Velaura Low Power Compute Tiles

The real opening is not replacing full AI chips, it is becoming the low-power block that bigger chip programs plug into. In a chiplet design, the customer can keep its own main accelerator die and buy a specialized tile for always-on sensing, local inference, control loops, or power-sensitive robotics tasks. That lets Velaura sell into the custom silicon buildout as a component supplier, where design wins can repeat across multiple package designs.

• TSMC is pushing the market toward exactly this kind of modular packaging. N2 is on track for volume production in the second half of 2025, while N2P and A16 are scheduled for volume production in the second half of 2026, and TSMC positions 3DFabric and CoWoS as ways to combine logic dies and specialty chiplets in one product.
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• The competitive model already exists. Tenstorrent is building an open chiplet ecosystem around reusable compute building blocks, and SiFive has framed chiplets and disaggregated dies as a way to mix general-purpose control silicon with domain-specific accelerators. That is the lane where a low-power specialist can matter without owning the whole system.
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• For Velaura, this changes the product from one-off IP work into a repeatable tile business. Titan Core and custom chiplet output suggest a path where the same ultra-low-power compute block can be adapted across robotics, Physical AI, and edge accelerator programs, with software and packaging know how raising switching costs over time.
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The next step is a move from selling designs to shipping a defined low-power compute subsystem with software, interfaces, and packaging hooks ready for integration. If that happens, Velaura becomes part of the supply chain for custom accelerators, which is a stronger place to sit as more AI hardware programs break into multiple dies.